|
The Max Dimension Of The Panel |
610x508mm (24”x20”) |
|
CERTIFICATION |
ISO 9002, UL |
|
MATERIALS |
• Double Sided:
FR-4 1/2oz – 4oz base Cu,
Polyimide,
Teflon
Arlon,
Rogers
• Multilayer (to 14 layers) FR-4 1/2oz – 4oz base CU, FR-406, FR-408, GETEK®, Rogers RO4000®
|
|
Profile And Tolerance Of The Finished Product |
|
|
Thickness Of The Finished Product |
0.45~3.00mm |
|
Thickness Tolerance |
+/-0.1mm |
|
Profile Tolerance |
+/-0.1mm |
|
Distance From The Center Of V-CUT To The Copper Edges |
0.5mm |
|
Deepness And Tolerance Of Bevel Edge |
0.6-1.6mm, +/-0.1mm |
| Conductor Width And Spacing |
|
|
The Minimum Conductor Width |
0.13mm(5mil) |
|
The Minimum Conductor Spacing |
0.13mm(5mil) |
|
The Hole Diameter And Tolerance |
|
|
The Minimum Hole Diameter Of The Finished Product |
0.2mm |
|
The Tolerance Of Hole Diameter (PTH) |
+/-0.075mm |
|
The Tolerance Of The Hole Sites(NPTH) |
+/-0.05mm |
|
Copper Plating Average Thickness Of The Hole Wall(PTH) |
20µm(Tin/Lead PCB)
20µm (gold PCB) |
|
Coating Thickness |
|
|
Nickel /Gold Finger |
Nickel :>2.5m
Gold :>0.05m |
|
Flash Gold PCB |
Nickel :>5m
Gold :>0.05m |
|
Hot Air Solder Leveling |
3~38µm |
|
Solder Mask And Legend |
|
|
Coating Thickness Over Conductors And Corners |
10µm |
|
Coating Thickness On The Laminate |
30~40µm |
|
The Minimum Width Of Bridge |
0.08mm |
|
The Minimum Width Of Legend |
0.13mm |
| Inner Layer |
|
|
The Minimum Inner Copper Thickness |
12µm |
|
The Minimum Conductor Copper Thickness Of The Surface |
33µm |
|
The Minimum Thickness Of Prepreg |
0.07mm |
|
The Minimum Thickness Of The Inner Core Board |
0.25mm |
| E-Test |
|
|
Voltage |
10~150V |
|
The Most Frequent Test Points |
8192 |
|
Open Resistance |
10¦¸ |
|
Short Resistance |
5!Á106¦¸ |
|
The File Format of CAD/CAM & Drilling |
|
|
Drilling File Format |
Excellon
Truedrill
S&M |
|
Film-Making File Format |
Gerber
RS-274-D
RS-274X
Protel
Pads |
|
Drawing File Format |
*.dxf
*.dwg
*.pdf
*.bmp |
